Thermally Conductive Materials 2024
Language:
Japanese
Product Code No:
C66116700
Issued In:
2024/11
#of Pages:
150
Publication Cycle:
Format:
PDF
Geographic Coverage:
Global
,
Japan
Industry:
Jump to the Japanese Page:
Coverage: (Product/service)
Thermally Conductive Materials
Research Target:
Manufacturers and research institutions (universities)
Research Content:
I Market Condition and Future Perspectives
Heatsink leads the global market
- Stable demand is expected across the board, driving the global market to exceed 600 billion yen
- Market for data centers surpassed 140 billion yen
- 2028 Global vaper chamber market expected to grow to 160% of 2023
- 2028 Domestic vaper chamber market forecasted to grow to around 110% of 2023 to reach 70 billion yen
- Global thermal gap filler market projected to exceed 50 billion yen by 2028, driven by automotive applications
- Domestic thermal gap filler market anticipates stable growth in the late 2020s
- Heat conduction sheets market expects moderate growth (global, domestic)
Shift from ceramic-based materials to resin-based accelerates in late 2020s
- Heatsink market (global, domestic) is projected to grow steadily in late 2020s
- Developing new applications and enhancing technology required for further market expansion
II Trends of Thermally Conductive Materials in Japan and Overseas
- Heat cooling systems
1 Heatsink
2 Heat pipe
2.1 Heat dissipating pipe
2.2 Loop heat pipes (LHP), Pulsating Heat Pipe (PHP)
2.3 Two-Phase Mechanically Pumped Fluid Loop (2PMPFL)
3 Vaper chamber
4 Cold plate
- Thermally conductive materials
1 Thermal gap filler
2 Thermal adhesives, thermal tapes
3 Thermal conduction sheets
4 Heatsink
- Thermally conductive material suppliers overseas
III Domestic Companies & Universities in Thermally Conductive Material Market
- Fujikura Ltd.
- Dai Nippon Printing Co.
- Murata Manufacturing Co.
- Fuji Polymer Industries Co.
- Sekisui Polymatech Co.
- NHK Spring Company (Nippatsu)
- Meiko Corporation
- Heishin Ltd.
- Okitsumo Corporation
- Taica Corporation
- Zaward Corporation
- Tohoku University
- Kagoshima University
- JSC Technology (Kumamoto University)