In-vehicle semiconductor market 2019

Language:
Japanese
Product Code No:
C61118600
Issued In:
2019/12
#of Pages:
137
Publication Cycle:
  
Format:
PDF
Geographic Coverage:
Japan
Industry:

Price

150,000 yen ($1,387.35)
(excluding consumption tax)
300,000 yen ($2,774.69)
(excluding consumption tax)
450,000 yen ($4,162.04)
(excluding consumption tax)
* Equivalent value in US$ (Today's rate : $1= 108.12 yen , 2020/03/31 Japan)

Coverage: (Product/service)

Semiconductors for automotive applications, in-vehicle micro processor, in-vehicle semiconductor sensors, in-vehicle power semiconductors

Research Target:

Device manufacturers, wafer suppliers, car electronics manufacturers, automakers

Research Content:

I        Overview of in-vehicle semiconductor market

1. Installation purposes and major devices
2. Trends in CASE
3. Transition of global market size 
4. Global market forecast 
 

II      Trends of the in-vehicle MCU (micro computer unit) market

1. Types and applications of in-vehicle MCU
2. Transition of market size
3. Share of in-vehicle MCU manufacturers
4. Market forecast
 

III     Latest trends of in-vehicle semiconductor manufacturers for ADAS / autonomous vehicles

1. NVIDIA
2. Mobileye
3. Xilinx
4. Ambarella
5. Renesas Electronics 
 

IV     Trends of the in-vehicle sensor market

1. Types and applications of in-vehicle sensors
2. Number of sensor installation per vehicle
3. Transition of market size
4. Market size forecast of in-vehicle sensors
5. Forecast of Market size of sensors for ADAS/AD
 

 V     Market analysis on in-vehicle MEMS 

1. Types and applications of in-vehicle MEMS
2. Market size transition
3. Share of in-vehicle MEMS manufacturers (pressure sensors for engine control)
4. Share of in-vehicle MEMS manufacturers (combo-sensors for ESC)
5. Trends in leading manufacturers of angular velocity sensor for ESC
6. Forecast of market size
 

 VI     Market analysis on semiconductor for in-vehicle radar 

1. Types of in-vehicle radar and technology trends
2. Number of installations and performance per autonomous driving level
3. Market size transition
4. Share of manufacturers (MMIC)
5. Forecast of market size
 

 VII     Market analysis on CIS/SoC for in-vehicle cameras 

1. CIS technology trends per application of in-vehicle cameras
2. Market size transition
3. Share of manufacturers (CIS)
4. Share of manufacturers (imaging processors for ADAS/AD cameras)
5. Forecast on number of in-vehicle cameras installed
6. Forecast of market size
 

VIII     Market analysis on in-vehicle power semiconductors 

1. Types and applications of in-vehicle power semiconductors
2. Trends in installing of in-vehicle power MOSFET as new applications
3. Market size transition
4. Share of manufacturers of in-vehicle power MOSFET
5. Forecast of market size 
 

IX    Market analysis on power module for xEV 

1. Applications of power module for xEV
2. Distribution structure of power module for xEV
3. Technology trends of power module for xEV
4. Supply chain of power module/inverter for xEV
5. Share of manufacturers of power module for xEV
6. Trends among leading manufacturers of power semiconductors
7. Feasibility analysis on SiC power semiconductors for xEV
8. Forecast of market size of power module for xEV

Price

written in Japanese
150,000 yen ($1,387.35)
(excluding consumption tax)
300,000 yen ($2,774.69)
(excluding consumption tax)
450,000 yen ($4,162.04)
(excluding consumption tax)
* Equivalent value in US$ (Today's rate : $1= 108.12 yen , 2020/03/31 Japan)