Sealing Compound Market 2013
Language:
Japanese
Product Code No:
C55124220
Issued In:
2013/12
#of Pages:
81
Publication Cycle:
Other
Format:
PDF
Coverage: (Product/service)
Sealant, encapsulation, packaging of semiconductors, PV cells, LED
Research Target:
sealing component manufacturers
Research Content:
I Semiconductor Sealing Compound: Trends and Outlook
- Epoxy molding compound for package sealing
- Liquid sealing materials
- Sumitomo Bakelite Co., Ltd.
- Hitachi Chemical Co., Ltd.
- Panasonic Corporation
- Shin-Etsu Chemical Co., Ltd.
- KYOCERA Chemical Corporation
- NAMICS CORPORATION
II PV cell sealants: Trends and Outlook
- China has developed sealing materials to be consumed domestically. Existing manufacturers cannot help being stalled.
- No abrupt replacement occurred even after the PID issue.
III LED sealing compound: Trends and Outlook
- The market maintains growth in response to the growth of white LED market
- With its high-refractive index, phenyl silicone encapsulants dominate the market for LED Packaging
- Shin-Etsu Chemical Co., Ltd.
- Dow Corning Toray Co.,Ltd.
- Momentive Performance Materials Inc.
IV Organic Electroluminescence (OEL) Sealing Comound Trends and Outlook
- For sealing materials for TV, the success of manufacturers depend on whether or not they have ever been adopted.
- Glass frit bonding is the standard sealing method for mid-or-small-sized panels
- DAEJOO ELECTRONIC MATERIALS CO.,LTD.
- NAGASE & CO., LTD.
- Mitsui Chemicals Tohcello, Inc.