Market Trends of Materials for Semiconductor Processing/CMP Precision Polishing 2013

Language:
Japanese
Product Code No:
C55121820
Issued In:
2013/10
#of Pages:
62
Publication Cycle:
  
Format:
PDF
Geographic Coverage:
Japan
Industry:

Price

80,000 yen ($591.98)
(excluding consumption tax)
160,000 yen ($1,183.96)
(excluding consumption tax)
240,000 yen ($1,775.94)
(excluding consumption tax)
* Equivalent value in US$ (Today's rate : $1= 135.14 yen , 2022/07/04 Japan)

Coverage: (Product/service)

Materials for Semiconductor Processing/CMP Precision Polishing

Research Target:

CMP slurry manufactures, other polishing materials manufacturers

Research Content:

This market trend report is created from excerpts from Market of Materials for Semiconductor Processing/CMP Precision Polishing for Printed Circuit Boards 2013.

I   Outlook of CMP Slurries for Semiconductors Processing

  1. Trends in Semiconductor Market
  1. Market Size by CMP Slurries Processing
  2. Trends in CMP Slurries Market
  3. Manufacturers
  1. Market of Slurries for Oxide Films
  1. Ceria slurries
  2. P-Si slurries
  1. Market of Slurries for Metals
  1. W slurries
  2. Cu bulk slurries

II   Outlook of Each of Polishing Material Market

  1. Polishing Materials Market for Si Wafers
  2. Polishing Materials Market for HD
  3. Polishing Materials Market for Glass Substrate (circuit boards)
  4. Polishing Materials Market for Sapphire/SiC/GaN Substrates

III    Trends in Raw Materials Market

  1. Colloidal silica market
  2. Cerium oxide market
  3. Fumed silica market
  4. List of materials procured

IV   Trends by Manufacturer
 

Price

written in Japanese
80,000 yen ($591.98)
(excluding consumption tax)
160,000 yen ($1,183.96)
(excluding consumption tax)
240,000 yen ($1,775.94)
(excluding consumption tax)
* Equivalent value in US$ (Today's rate : $1= 135.14 yen , 2022/07/04 Japan)