Materials and Sub-Materials Market for Semiconductor Fabrication Processes

Semiconductor Fabrication Process Materials and Sub-Material Manufacturers

The report contains research on the current trends and future business strategies of manufacturers of materials and sub-materials used in semiconductor fabrication processes. It provides an understanding of the current and future trends in the global semiconductor fabrication process materials and sub-materials market.

I    Semiconductor Fabrication Process Materials and Sub-Materials Market Outlook and Strategy

• CAGR for semiconductor fabrication process materials and submaterials market by item is around 1 to 3%.
• LMC used in high-end servers and generative AI will continue to grow at a high CAGR of 18.3%
• High-bandwidth memory (HBM), the next-generation memory technology that enables high-speed, large-capacity data transfer, is attracting attention.
• SK Hynix widens the gap from Samsung in the fourth generation of HBM3 and beyond. Unique HBM stacking process using Liquid Compression Mold Underfills (LCMUF) strengthens SK Hynix's position.
• Only One & Number One material development realizes cutting-edge packaging processes

II    Trend of Semiconductor Fabrication Process Materials and Sub-Materials Market

1. Wafer Protection Tapes
   1) Back-grinding tape
   2) Dicing tape
2. Trend of Die Attach Materials Market
   1) Die Attach Film (DAF)
   2) Die Attach Paste (DAP)
3. Trend of Semiconductor Sealing Materials
   1) Sealants (encapsulation)
       - Epoxy Molding Compound (EMC）
       - LMC（Liquid Molding Compound (LMC)）
       - Sheet-Form Encapsulation Material
   2) Underfills
       - CUF（Capillary Underfill (CUF)
       - NCF（Non Conductive Film (NCF）

III    Trend of Semiconductor Fabrication Process Materials and Sub-Materials Manufacturers

• LINTEC Corporation
• Furukawa Electric Co., Ltd.
• Mitsui Chemicals ICT Materia, Inc.
• Resonac Corporation
• Sumitomo Bakelite Co., Ltd.
• Panasonic Industry Co., Ltd.
• Nagase ChemteX Corporation (NCX)
• NAMICS CORPORATION
• Samsung SDI Co., Ltd.
• KCC Corporation
• Tanaka Kikinzoku Kogyo,