This report was compiled based on articles published in the January 2025 issue of our periodical, “Yano E plus”.

Advancements in Semiconductor Miniaturization, Multi-layer interconnection, Complex Gate Structures, and 3D Integration: Increasing Importance of CMP Processes in Advanced Logic

1. Introduction to CMP
2. Characteristics of CMP Technology

2.1. High-Precision Planarization
2.2. Uniformity of Complex Structures
2.3. Versatility
2.4. Role of Slurry
2.5. Interaction Between Pad and Substrate
2.6. Pressure and Rotational Motion
2.7. Endpoint Detection
2.8. Defect Control

3. Evolution of CMP Technology

3.1. 1980s: Initial Research and Establishment of Basic Technologies
3.2. 1990s

　　(1) Commercialization and Adoption of CMP
　　(2) Technological Advancements in CMP

3.3. 2000s

(1) Diversification of Materials and Processes
(2) Adaptation to Nanometer-Scale Devices

3.4. 2010s

(1) Introduction of New Materials and Technologies
(2) Automation and Optimization of CMP

3.5. Post-2020

(1) Adaptation to Next-Generation Technologies

4. New Trends in CMP Technology

4.1. Enhanced Precision at the Nanometer Scale
4.2. Adoption of 3D NAND and FinFET Structures
4.3. Compatibility with New Materials
4.4. Low Defectivity and High Throughput
4.5. Automation and Digitalization of CMP

5. Market Size of CMP
6. Activities of Companies and Research Institutions Related to CMP

6.1. Gifu University, Tokai National Higher Education and Research System

(1) Proposal of New Visualization Methods for CMP Processes
(2) Development of Next-Generation CMP Based on New Principles

6.2. Kyushu Institute of Technology

(1) Research on CMP for Silicon Power Semiconductors
(2) Research on Design of Polishing Particles Centered on Fullerene C60 Composite Smart Polishing Particles
(3) Research on Micro-Pattern Pads

6.3. Doi Laboratory Co., Ltd.

(1) Current Status and Future of Silicon Semiconductor Processing and Planarization CMP

① Ultra-Precision Processing of Bare Si Wafers
② Planarization CMP of Device Wafers

(2) Processing of Ultra-Hard Materials (SiC, GaN, Diamond) for Next-Generation 3D Heterogeneous Integration Devices

6.4. TOPPAN Infomedia Inc.

(1) Case Studies of CMP Slurry Applications

① For RDL Interposer
② For Hybrid Bonding of Resin/Metal

(2) CMP Slurry Product Lineup

6.5. Ritsumeikan University

(1) Processing Mechanism of ECMP Using SPE
(2) ECMP Polishing Equipment
(3) Evaluation of Polishing Performance by ECMP

7. Challenges and Future Prospects of CMP

7.1. Key Challenges
7.2. Future Prospects