This report was compiled based on articles published in the February 2025 issue of our periodical, “Yano E plus”.

Fragmenting large-scale circuits previously integrated into a single chip into multiple chips, maintaining the benefits of miniaturization while adding new value to the chips

1. Introduction to Chiplets
2. Characteristics of Chiplets
3. Latest Technological Trends in Chiplets
4. Demand Sectors for Chiplets
5. Market Size of Chiplets
6. Activities of Companies and Research Institutions Related to Chiplets

6-1. Institute of Science Tokyo (1)

Figure 1: Comparison of Via-First and Via-Last in Interface Formation
Figure 2: BBCube WOW Process Flow
Figure 3: BBCube COW Process Flow
Figure 4: Relationship Between Energy Consumption for Signal Connection and Transmission Bandwidth

6-2. Institute of Science Tokyo (2)

(1) Chiplet Integration Platform Consortium
Figure 5: Concept of the Chiplet Integration Platform Consortium

(2) Development of Chiplet Integration Technology
Figure 6: Chiplet Integration Technology Using PSB
Figure 7: External Connection Structure of PSB Module
Figure 8: Image of Large-Scale Chiplet Integration

6-3. TOWA Corporation

Figure 9: Prospects of PLP

6-4. Yokohama National University

(1) Hybrid Bonding Technology
Figure 10: Schematic Diagram of Hybrid Bonding
Figure 11: Typical Hybrid Bonding Process

(2) Chiplet Integration Technology
Figure 12: Chiplet Integration Process

(3) Semiconductor Consortium Originating from Yokohama National University
Figure 13: Open Innovation Platform for Front-End and Back-End Process Integration

7. Challenges and Future Prospects of Chiplets

7-1. Challenges

(1) Limitations of Interposers and Interconnects
(2) Design Complexity
(3) Complexity in Manufacturing and Testing
(4) Cost
(5) Difficulty in Thermal Management
(6) Lack of Design Standardization

7-2. Future Prospects

(1) Progress in Standardization and Ecosystem Development
(2) Development of Next-Generation Interposer Technology
(3) Adoption of Heterogeneous Integration
(4) Evolution of Interface Technology
(5) Expansion of Applications in AI and HPC Fields
(6) Realization of Low-Cost, Short-Term Development Cycles
(7) Contribution to Application Fields