Resent Trends of High-Density Large Scale Integration (LSI) (Researched in January 2020)
Coverage: (Product/service)
High-Density Large Scale Integration (LSI)
Research Content:
This report was compiled based on an article introduced in our periodical, “Yano E plus” of February 2020 issue.
1.How Much Semiconductors Micronize
2.Current Mainstream of High-Density LSI Process
2-1.FinFET
2-2.FD-SOI
3.Transition and Forecast of Market Size
4.Market Share
5.What Companies and Research Institutes Do
5-1.National Institute of Advanced Industrial Science and Technology (AIST)
5-2.Shonan Institute of Technology [Japan]
5-3.Tokyo Institute of Technology [Japan]
5-4.GlobalFoundries (GF) [United States]
5-5.International Business Machines Corporation (IBM) [United States]
5-6.Intel Corporation [United States]
5-7.NXP Semiconductors N.V. (NXP) [Netherlands]
5-8.Soitec S.A. [France]
5-9.STMicroelectronics NV (ST) [Netherlands]
5-10.Synopsys International Ltd. (Synopsys) [United States]
5-11.Taiwan Semiconductor Manufacturing Co., Ltd.(TSMC) [Taiwan]
6.What is beyond FinFET and FD-SOI?