Semiconductor Packaging Substrate Materials Market 2025

Language:
Japanese
Product Code No:
C66127100
Issued In:
2025/03
#of Pages:
95
Publication Cycle:
Other
Format:
PDF
Geographic Coverage:
, Global , Japan , Korea ,
Industry:
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Price

180,000 yen ($1,265.64)
(excluding consumption tax)
360,000 yen ($2,531.29)
(excluding consumption tax)
540,000 yen ($3,796.93)
(excluding consumption tax)
* Equivalent value in US$ (Today's rate : $1= 142.22 yen , 2025/04/30 Japan)
*Scope of Each License Type

Coverage: (Product/service)

Semiconductor Packaging Substrate Materials

Research Target:

Manufacturers

Research Content:

This report contains the status of semiconductor packaging materials manufacturers and future business measures, which helps to understand the current status and future trend of the global semiconductor packaging substrate materials market.

TOC:

I   Outlook and Strategy for the Semiconductor Packaging Substrate Materials Market

  • In the accelerated split between the U.S. and China, what is needed to continue being a major supplier in the semiconductor industry?
  • The semiconductor package substrate materials market is estimated to reach 398,229 million yen in 2024.
  • Backed by expanding demand for AI accelerators and cutting-edge packaging materials, the market is expected to grow in 2025 and beyond.
  • China's semiconductor industry is accelerating its shift to domestic production, and although there is no immediate impact on demand for package substrate materials, from a political and economic security perspective, it is expected to gradually shift to domestic production over the medium to long term.
  • Despite the extremely high entry barrier into the existing supply chain of semiconductor materials, there should be an opportunity for entry at a time when a demander is considering a drastic change in package design or other need to change from conventional practices.
  • There is no guarantee that the current state-of-the-art supply chain will continue.
  • By looking at the potential future changes, companies should develop and propose solutions that can lead to breakthroughs for the next generation of semiconductor packaging.

II    Semiconductor Packaging Substrate Materials Market Trend

  1. Copper Clad Laminate Market Trend
  2. Build-Up Film Market Trend
  3. Solder Resist Market
    1) Liquid Solder Resists
    2) Dry Film Solder Resists
  4. Buffer/Redistribution Materials Market

III    Trends in Semiconductor Packaging Substrate Material Manufacturers

  • Resonac Holdings Corporation
  • Mitsubishi Gas Chemical Company, Inc.
  • Doosan Corporation Electro-Materials
  • Panasonic Industry Co., Ltd.
  • Sekisui Chemical Company, Limited
  • Sumitomo Bakelite Co., Ltd.
  • Toray Industries, Inc.
  • FUJIFILM Electronic Materials Co.,Ltd.
  • AGC Inc.

Price

written in Japanese
180,000 yen ($1,265.64)
(excluding consumption tax)
360,000 yen ($2,531.29)
(excluding consumption tax)
540,000 yen ($3,796.93)
(excluding consumption tax)
* Equivalent value in US$ (Today's rate : $1= 142.22 yen , 2025/04/30 Japan)
*Scope of Each License Type