Thermal Conductive Materials 2022

Language:
Japanese
Product Code No:
C64112000
Issued In:
2022/08
#of Pages:
118
Publication Cycle:
  
Format:
PDF
Geographic Coverage:
Global , Japan
Industry:

Price

150,000 yen ($1,116.74)
(excluding consumption tax)
300,000 yen ($2,233.47)
(excluding consumption tax)
450,000 yen ($3,350.21)
(excluding consumption tax)
* Equivalent value in US$ (Today's rate : $1= 134.32 yen , 2022/12/04 Japan)

Coverage: (Product/service)

Thermal Conductive Materials

Research Target:

Manufacturers, dealers, and research institutions of thermal conductive materials

Research Content:

I. Vapor Chamber
1.Noteworthy vapor chambers and similar thermal conductive materials  
  1-1.Vapor Chamber
  1-2.Heat Pipe
  1-3.Integrated Heat Spreader
2.Forecast of vapor chamber market size 
3.Trends at companies/research institutions developing vapor chambers 
  3-1.FCNT Limited 
  3-2.Kagoshima University (National University)
  3-3.Zaward Corporation
  3-4.Dai Nippon Printing Co., Ltd.(DNP)
  3-5.Tohoku University
  3-6.Fujikura Ltd.
  3-7.LEADING EDGE ASSOCIATES (LEA, Taiwan)
4.Future perspective of vapor chambers
 

II. Thermally Conductive Gap Filler/ Thermal Conductive Sheet

 
1.What is thermally conductive gap filler? 
2.What is thermal conductive sheet?
3.Forecast of thermally conductive gap filler / thermal conductive sheet market size 
4.Trends at companies/research institutions developing thermally conductive gap fillers 
  4-1.Kimurayoko
  4-2.TOMOE Engineering 
  4-3.HEISHIN
5.Trends at companies/research institutions developing thermal conductive sheets 
  5-1.INOAC Corporation
  5-2.Okitsumo
  5-3.Oki Electric Cable 
  5-4.Taica Corporation
  5-5.Fuji Polymer Industries
6.Future perspective of thermally conductive gap filler / thermal conductive sheet
  6-1.Thermally conductive gap filler
  6-2.Thermal conductive sheet
 

III. Thermally Conductive Adhesives/ Encapsulants/Printed Circuit Boards

1.Thermally conductive adhesives/encapsulants 
2.Thermally conductive printed circuit boards
3.Forecast of thermally conductive adhesives/encapsulants/printed circuit boards market
4. Trends at companies/research institutions developing thermally conductive adhesives/encapsulants
  4-1.Sekisui Chemical 
  4-2.Risho Kogyo 
5.Trends at companies/research institutions developing thermally conductive printedciruit boards
  5-1.UBE Corporation
  5-2.NHK Spring
  5-3.Meiko Electronics 
  5-4.Risho Kogyo 
6.Future perspective of thermally conductive adhesives/encapsulants/printed circuit boards 
  6-1.Thermally conductive adhesives/encapsulants
  6-2.Thermally conductive printed circuit boards market
 

IV. Special Project- Related Market (Heat Pipe)

1.Market outline
2.Trends by segment 
  2-1.Heat pipes for fridges and air conditioners 
  2-2.Heat pipes for personal computers 
  2-3.Domestic heat pipe casing  materials 
3.Noteworthy Topic
  3-1.Expectations for heat transporting technology using renewable energy as environmental project 
  3-2.Pursuit for technological innovation in development of heat pipes for space
4.Future perspective

Price

written in Japanese
150,000 yen ($1,116.74)
(excluding consumption tax)
300,000 yen ($2,233.47)
(excluding consumption tax)
450,000 yen ($3,350.21)
(excluding consumption tax)
* Equivalent value in US$ (Today's rate : $1= 134.32 yen , 2022/12/04 Japan)