Thermally Conductive Materials 2022
Language:
Japanese
Product Code No:
C64112000
Issued In:
2022/08
#of Pages:
118
Publication Cycle:
Format:
PDF
Geographic Coverage:
Global
,
Japan
Industry:
Jump to the Japanese Page:
Coverage: (Product/service)
Thermally Conductive Materials
Research Target:
Manufacturers, dealers, and research institutions of thermal conductive materials
Research Content:
I. Vapor Chamber
1．Noteworthy vapor chambers and similar thermal conductive materials
1-1．Vapor Chamber
1-2．Heat Pipe
1-3．Integrated Heat Spreader
2．Forecast of vapor chamber market size
3．Trends at companies/research institutions developing vapor chambers
3-1．FCNT Limited
3-2．Kagoshima University (National University)
3-3．Zaward Corporation
3-4．Dai Nippon Printing Co., Ltd.（DNP）
3-5．Tohoku University
3-6．Fujikura Ltd.
3-7．LEADING EDGE ASSOCIATES (LEA, Taiwan)
4．Future perspective of vapor chambers
II. Thermally Conductive Gap Filler/ Thermal Conductive Sheet
1．What is thermally conductive gap filler?
2．What is thermal conductive sheet?
3．Forecast of thermally conductive gap filler / thermal conductive sheet market size
4．Trends at companies/research institutions developing thermally conductive gap fillers
4-1．Kimurayoko
4-2．TOMOE Engineering
4-3．HEISHIN
5．Trends at companies/research institutions developing thermal conductive sheets
5-1．INOAC Corporation
5-2．Okitsumo
5-3．Oki Electric Cable
5-4．Taica Corporation
5-5．Fuji Polymer Industries
6．Future perspective of thermally conductive gap filler / thermal conductive sheet
6-1．Thermally conductive gap filler
6-2．Thermal conductive sheet
III. Thermally Conductive Adhesives/ Encapsulants/Printed Circuit Boards
1．Thermally conductive adhesives/encapsulants
2．Thermally conductive printed circuit boards
3．Forecast of thermally conductive adhesives/encapsulants/printed circuit boards market
4. Trends at companies/research institutions developing thermally conductive adhesives/encapsulants
4-1．Sekisui Chemical
4-2．Risho Kogyo
5．Trends at companies/research institutions developing thermally conductive printedciruit boards
5-1．UBE Corporation
5-2．NHK Spring
5-3．Meiko Electronics
5-4．Risho Kogyo
6．Future perspective of thermally conductive adhesives/encapsulants/printed circuit boards
6-1．Thermally conductive adhesives/encapsulants
6-2．Thermally conductive printed circuit boards market
IV. Special Project- Related Market (Heat Pipe)
1．Market outline
2．Trends by segment
2-1．Heat pipes for fridges and air conditioners
2-2．Heat pipes for personal computers
2-3．Domestic heat pipe casing materials
3．Noteworthy Topic
3-1．Expectations for heat transporting technology using renewable energy as environmental project
3-2．Pursuit for technological innovation in development of heat pipes for space
4．Future perspective