Thermal Conductive Materials Market 2016
Language:
Japanese
Product Code No:
C57125200
Issued In:
2016/05
#of Pages:
160
Publication Cycle:
Other
Format:
PDF
Geographic Coverage:
Japan
Industry:
Jump to the Japanese Page:
Coverage: (Product/service)
Thermal Conductive Fillers, Thermal Interface Materials (TIM), Thermal Relief on PCB
Research Target:
Manufacturers of Conductive Fillers, Thermal Interface Materials (TIM), Thermal Relief on PCB, modules, etc.
Research Content:
I Current Status and Future Perspectives of Thermal Conductive Materials Market
- Improve easiness of handling of such components at customers required, so that customers are able to design products using them.
- With expanding needs for heatsink in applications, market growth is expected especially in automobile sector
II Thermal Conductive Materials Markets
- Thermal Conductive Filler Market
- THERMAL INTERFACE MATERIAL (TIM) Market
- Market of Thermal Relief on PCB
III Structure of Thermal Conductive Materials by Use/Application
- With rising needs for changing designs, switching of production locations, and higher thermal conductive materials needs, competition among materials have been intensified by use
- PCs (Desktop/Note/Tablets) , Smart phones
- LEDs (lighting, TV, Automobile head lamps, etc.)
- Radio Base Stations, etc.
- Autobmobiles (ECU, batteries)
- Power Modules
IV Trends at Manufacturers
16 manufacturers