Materials used in semiconductor manufacturing and packaging processes in Japan

Major manufacturers/suppliers in Japan

I    Prospects of Semiconductor Manufacturing Materials Market

• Despite slow growth of DC tapes and EMC, DAF and underfill materials show favorable growth.
• Semiconductor technologies shift from minituarization to lamination
• The success of manufacturers seems to depend on the speed of product development
• Enhancement of competitivity by adopting integrated local-based R&D, manufacturing, sales, and services

II    Trends and Outlook of Semiconductor Manufacturing Materials Market

1. Trends of Wafer Protection Tape Market

1. Backgrinding (BG) tape
2. Dicing (DC) tape

2. Die bonding material market

1. Die bonding tape/die attach film (DAF)
2. Die bonding paste
3. LOC tape

3. Encapsulant market

1. Epoxy molding compound for package encapsulation
2. Liquid encapsulant (underfill material)

III   Trends in Semiconductor Materials Manufactrers

12 Enterprises

IV    Prospects of CMP Slurries for Semiconductor Processing

• Since CMP slurries are expected to be higher dilution and higher concentration, it has become difficult to align with the growth of wafer market.

1. Slurry Market for Oxide Film

1. ILD slurry market
2. Ceria based slurry market
3. P-Si slurry market

2. Slurry Marekt for Metal Wiring

1. W slurry market
2. Cu bulk slurry market
3. Cu barrier slurry market

Trends in Manufacturers (3 enterprises)